Shaping metal without using heat is a dream come true thanks to a team of Singaporean researchers.
Inspired by natural processes observed in certain marine organisms, these scientists have developed a method that could revolutionize the metallurgical industry. Their innovative approach, detailed in
Advanced Functional Materials, is based on the use of chitosan, a derivative of chitin, an abundant organic material in nature.
Chitin, found in the shells of crustaceans, fungi, and many other organisms, is known for its lightness and strength. These properties make it a prime material for engineers seeking sustainable solutions. As explained by Javier Fernandez, Associate Professor at the Singapore University of Technology and Design (SUTD), nature finds efficient solutions without resorting to intensive energy sources. This observation led his team to explore the application of chitin in metallurgy.
The method developed by the researchers allows for the formation of functional metallic structures at room temperature, a first in the field. By using chitosan dissolved in water, they created a metallochitinous composite by introducing metal particles. As the water evaporates, the chitosan molecules bind the particles together, forming a solid composed of 99.5% metal. This technique requires neither melting nor high pressure, unlike traditional metallurgical methods.
Although the composites produced do not have high mechanical strength, they exhibit good electrical conductivity and can be 3D printed. These characteristics make them particularly appealing for applications in the electronics industry, notably for the manufacture of non-load-bearing components or battery electrodes. Javier Fernandez emphasizes that this technology does not replace traditional methods but offers complementary and more environmentally friendly alternatives.
The prospects offered by this innovation are promising. Javier Fernandez's team has already filed a patent for this manufacturing method and is now working on the development of biodegradable 3D electronic components. This advancement could pave the way for more efficient and sustainable production methods in the electronics industry.
Author of the article: Cédric DEPOND